@inproceedings{TUW-304606,

title = {Modeling Thermal Effects in STT-MRAM},

author = {Tomáš Hadámek and Wolfgang Goes and Siegfried Selberherr and Viktor Sverdlov},

year  = {2022},

date = {2022-09-06},

booktitle = {SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet},

pages = {11--12},

note = {talk: International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022), Granada, Spain; 2022-09-06 -- 2022-09-08},

keywords = {STT-MRAM, temperature modeling},

pubstate = {published},

tppubtype = {inproceedings}

}

@inproceedings{TUW-304589,

title = {Temperature Modeling in STT-MRAM:A Fully Three-Dimensional Finite Element Approach},

author = {Tomáš Hadámek and Simone Fiorentini and Mario Bendra and Roberto Orio and Wilton Jaciel Loch and Nils Petter Jørstad and Siegfried Selberherr and Wolfgang Goes and Viktor Sverdlov},

year  = {2022},

date = {2022-06-06},

booktitle = {Book of Abstracts of the International Conference on Nanostructured Materials (NANO)},

note = {talk: 16th International Conference on Nanostructured Materials, Sevilla, Spain; 2022-06-06 -- 2022-06-10},

keywords = {STT-MRAM, temperature modeling},

pubstate = {published},

tppubtype = {inproceedings}

}