SYMBOL | DESCRIPTION | UNIT |
channel thickness | cm | |
effective Richardson constant | Acm K | |
heat capacity | J kgK | |
electron, hole Auger coefficient | cms | |
electron, hole diffusivity | cms | |
electric field | Vcm | |
breakdown/critical electric field | Vcm | |
acceptor, donor energy | eV | |
indirect bandgap | eV | |
exciton energy gap | eV | |
conduction, valence band energy | eV | |
Fermi energy | eV | |
electron, hole, trap energy | eV | |
intrinsic Fermi energy | eV | |
exciton binding energy | eV | |
acceptor, donor ionization energy | eV | |
frequency | Hz | |
cutoff frequency | Hz | |
maximum frequency | Hz | |
occupation probability of traps | 1 | |
generation rate | cm s | |
electron, hole impact ionization coefficients | cm | |
conductance | AV | |
acceptor, donor degeneracy factor | 1 |
SYMBOL | DESCRIPTION | UNIT |
electric current density | Acm | |
particle current density | cm | |
thermal conductivity | Wcm K | |
gate length | cm | |
electron, hole diffusion length | cm | |
electron, hole effective mass | kg | |
carrier mobility | cmV s | |
low field carrier mobility | cmV s | |
high field carrier mobility | cmV s | |
undoped material carrier mobility | cmV s | |
highly doped material carrier mobility | cmV s | |
number of minima in the conduction and valence band | 1 | |
electron density | cm | |
intrinsic density | cm | |
Shockley-Read-Hall parameter | cm | |
blocking layer doping concentration | cm | |
acceptor, donor doping concentration | cm | |
effective density of states | cm | |
ionized donor concentration | cm | |
ionized acceptor concentration | cm | |
density of occupied traps | cm | |
density of empty traps | cm | |
doping concentrartion at ( /2 | cm | |
hole density | cm | |
Shockley-Read-Hall parameter | cm | |
elementary electric charge | As | |
electron, hole quasi-Fermi potential | V | |
barrier height | V | |
metal work function | V | |
semiconductor work function | V | |
work function difference | V | |
electrostatic potential | eV | |
built-in potential | eV | |
relative dielectric constant | 1 | |
recombination rate | cm s | |
specific on-resistance | VcmA | |
electrical conductivity | AV cm | |
resistivity | VcmA | |
charge density | Ascm | |
entropy density | eVK cm | |
electron, hole energy flux density | Jcm s | |
temperature | K |
SYMBOL | DESCRIPTION | UNIT |
electron, hole, and lattice temperature | K | |
reference temperature (300 K) | K | |
elctron, hole energy relaxation times | s | |
effective lifetime of recombination or generation process | s | |
effective electron, hole minority carrier lifetime | s | |
electron, hole minority carrier lifetime of impurity t | s | |
trap, acceptor, donor time constant | s | |
space charge generation lifetime | s | |
total energy density | eVcm | |
substitute for electron or hole density | cm | |
carrier velocity | cms | |
electrons, holes, saturation velocity | cms | |
constant specifying how velocity goes into saturation | 1 | |
breakdown voltage | V | |
built-in voltage | V | |
drain, gate, source voltage | V | |
threshold voltage | V | |
depletion region width | cm | |
gate width | cm | |
angular frequency | Hz | |
electron affinity | V | |
acceptor, donor ionization degree | 1 | |
constant measure how mobility changes from to | 1 | |
constant temperature coefficient for | 1 | |
constant temperature coefficient for | 1 | |
phonon energy | eV |
T. Ayalew: SiC Semiconductor Devices Technology, Modeling, and Simulation