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The constitutive relations for a linear, temperature dependent conductor are
I |
= |
V . G( ) |
(2.29) |
G( ) |
= |
G0 . 1 + . (
- )![$\displaystyle \left.\vphantom{ 1 + \alpha \cdot (\vartheta - \vartheta_{\mathit{ref}}) }\right)$](img110.gif) |
(2.30) |
P |
= |
V . I |
(2.31) |
If
![$ \alpha$](img111.gif)
0, the conductor will be modeled temperature dependently.
For thermal simulation the dissipated power P will result in self-heating of
the conductor and the problem becomes non-linear. Otherwise the temperature
dependent entries are ignored. The stamp is given as
yx, y |
![$ \varphi_{1}^{}$](img5.gif) |
![$ \varphi_{2}^{}$](img6.gif) |
![$ \vartheta$](img104.gif) |
f |
n1 |
G |
- G |
- V . . G0 |
- I |
n2 |
- G |
G |
V . . G0 |
I |
![$ \vartheta$](img104.gif) |
-2 . V . G |
2 . V . G |
- V2 . . G0 |
P |
Figure 2.5:
Electro-thermal compound model for a heat dissipating resistor
![\begin{figure}
\begin{center}
\resizebox{7.8cm}{!}{
\psfrag{n-term}{\hspace*{-1....
...
\includegraphics[width=7.8cm,angle=0]{figures/res.eps}}\end{center}\end{figure}](img113.gif) |
The conductor acts as a heat source connected to the thermal circuit node
and to thermal ground (reference temperature).
Next: 2.3.3.2 Resistor
Up: 2.3.3 Devices
Previous: 2.3.3 Devices
Tibor Grasser
1999-05-31