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The design and fabrication processes of an IC are a highly
complicated endeavor. Modern Very Large Scale Integration (VLSI)
technology consists of hundreds of sequential process steps starting
with a raw semiconductor wafer. These steps can be classified into
three groups [EK95]:
- Structural manufacturing using lithography [Kir96][Kir98] and
etching [Str94][Str95] processes
for structural design and pattern transfer
- Insulation and metallization by oxidation and
deposition [Sch91][Str93]
- Layer modification by several ion implantation [Boh95a][Boh96] and diffusion [Puc95][Puc96a] steps at different temperatures
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Mustafa Radi
1998-12-11