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Although it is possible to perform statistical analysis with SIESTA
in its current state, a lot of work remains still to be done in this
area. One could think of features which are able to automatically
detect correlations between fabrication parameters and device
parameters, or of a setup which is able to generate scattering plots
of fabrication data. Such features could help engineers to enhance the
yield of an IC fabrication process by means of TCAD.
Rudi Strasser
1999-05-27