CDL₄ProMod once again at SISPAD

The 2024 SISPAD conference will have 5 oral contributions from the CDL₄ProMod:

1. Reiter, A. Toifl, S. Kong, A. Hössinger, and L. Filipovic, “Impact of Ion Energy and Yield in Oblique Ion Beam Etching Process for Blazed Gratings,” in 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2024.
2. S. Leroch, R. Stella, A. Hössinger, and L. Filipovic, “MD Simulation of Epitaxial Recrystallization and Defect Structure of Al-Implanted 4H-SiC,” in 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2024.
3. B. Bamer, S. Leroch, A. Hössinger, and L. Filipovic, “Cluster-Based Semi-Empirical Model for Dopant Activation in Silicon Carbide,” in 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2024.
4. L. Filipovic, T. Reiter, J. Piso, and R. Kostal, “Equipment-Informed Machine Learning-Assisted Feature-Scale Plasma Etching Model,” in 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2024.
5. Z. Hu, L. Filipovic, J. Li, L. Wang, Z. Wu, et al., “Modeling Non-Uniformity During Two-Step Dry Etching of Si/SiGe Stacks for Gate-All-Around FETs,” in 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), 2024.