This project aims at developing a complete mature 3D integration technology platform covering the entire range of processes required from vertical interconnects (TSV, micro bumps…) and robust bonding to innovative packaging approaches to address a wide range of products.
The main objectives of this project is to achieve chip-level three-dimensional (3D) TSVintegration, Wafer-to-Wafer and Die-to-Wafer bonding, and packaging of stacked circuits, in order to create a complete technological platform for high performance and cost effective 3D systems manufacturing.
The objective of the COCOA project is to define a robust 3D integration technology platform covering the existing gap between medium (104 cm-2) and high density (106 cm-2) technologies, including packaging of two or more stacked layers.
