SiC is a wide band-gap indirect semiconductor with high breakdown voltage and
high saturation electron drift velocity. It is chemically inert and of high
hardness. While all SiC modifications have quite the same mechanical and
thermal properties, their electrical and optical properties differ greatly from
polytype to polytype [10].
Electronic devices formed in SiC can operate at extremely high temperatures
without suffering from intrinsic conduction effects ( orders of
magnitude lower than Si) because of the wide energy bandgap. SiC can withstand
a voltage gradient (or electric field) 5 to 20 times greater than Si or GaAs
without undergoing avalanche breakdown [11]. This high breakdown
electric field enables the fabrication of high-voltage and high-power
devices. Additionally, it allows the devices to be placed very close together,
providing high device packing density for integrated circuits. SiC is an
excellent thermal conductor. In fact, at room temperature, SiC has a higher
thermal conductivity than any metal ( times higher than
Si) [12]. This property enables SiC devices to operate at extremely
high power levels and still dissipate the large amounts of excess heat
generated. SiC devices can operate at high frequencies (RF and microwave)
because of the larger saturated electron drift velocity which is times
that of Si [13].