Symbol | Unit | Description | ||
1 | Engineering strain component | |||
1 | Component of the strain tensor | |||
GPa | Component of the stress tensor | |||
GPa | Component of the elastic stiffness tensor | |||
GPa | Component of the contracted stiffness tensor | |||
GPa | Component of the elastic compliance tensor | |||
GPa | Component of the contracted compliance tensor | |||
eV | Electron affinity of the semiconductor | |||
ms | Electron diffusion coefficient | |||
ms | Hole diffusion coefficient | |||
Vm | Electric field | |||
eV | Energy | |||
eV | Conduction band edge energy | |||
eV | Valence band edge energy | |||
eV | Band gap energy | |||
V | Potential | |||
eV | Work function difference between metal and semiconductor | |||
meV | Density of states | |||
eV | Phonon energy | |||
Am | Electron current density | |||
Am | Hole current density | |||
m | Wave number | |||
m | Wave number vector | |||
1 | Relative dielectric permittivity | |||
1 | Relative magnetic permeability | |||
mVs | Electron mobility | |||
mVs | Hole mobility | |||
mVs | Effective electron mobility | |||
kg | Mass | |||
kg | Carrier effective mass in the semiconductor |
Symbol | Unit | Description | ||
m | Electron concentration | |||
m | Intrinsic concentration | |||
m | Concentration of donors | |||
m | Concentration of acceptors | |||
m | Effective density of states of the conduction band | |||
m | Effective density of states of the valence band | |||
m | Hole concentration | |||
s | Time | |||
s | Momentum relaxation time | |||
K | Temperature | |||
ms | Velocity | |||
ms | Velocity vector | |||
V | Gate-source voltage | |||
V | Drain-source voltage |