When some native oxide is present, both interfaces, Si-SiO and SiO
-ambient already exist and the oxide does not need to
grow from scratch. How much additional oxide will grow depends on the oxidation time, temperature, ambient, pressure, crystal
orientation of the silicon, as well as the thickness of native oxide already present on the surface. The implementation of
such velocity fields within the LS is described in Section 3.2.1, while the Massoud model is used to determine the
oxidation rate.
When 10nm of native oxide is present, the oxidation process begins with nm, as shown in Figure 6.2a, where the
surface representing the Si-SiO
is the bottom (blue) surface, the SiO
-ambient interface is the top (red) surface
and the volumes depicted are of the silicon substrate (yellow-bottom) and the native oxide (blue-top).
As the process begins, the Si-SiO
interface moves deeper into the Si wafer, while the SiO
-ambient interface grows towards
the ambient.
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Using the Massoud model, after 100 minutes of oxidation of a (100) oriented silicon wafer in a dry ambient at 1atm pressure and 1000
C
temperature, a total oxide thickness of 73.8nm is found, meaning that 63.8nm of new oxide has been grown,
depicted in Figure 6.2b. Even though the oxidation conditions were identical to the process shown in
Figure 6.1, less oxide is grown, when there is already some initial oxide present. This is expected since oxidation
is fastest during the initial stages of oxidation.