In the 1960’s, the investigations of the Si- interface revealed a close-coupling of
the increase of surface traps sitting at the interface and a phenomenon which will
be later on known as the bias temperture instability. Both effects were known
to cause a negative shift of the threshold voltage [3, 4, 53]. Though
this phenonmenon was already known not to cause real device failure as
for example time dependent dielectric breakdown (TDDB) [35, 54], the
creeping shift of
alerted the industry and the scientific community to
develop a model which is capable of describing the mechanisms behind
BTI. In order to judge such a model as functional, clear definitions of its
applicability but also potential limits have to be listed. The following review
summarizes the existing modeling efforts, including their advantages and
disadvantages.