The degraded in small-area transistors with only a few defects relaxes in
discrete steps. Each step reveals a hole emission event at the emission time
of a particular defect [115, 111]. Larger devices contain
a larger number of defects, which in combination with a nearly uniform
distribution of the activation energies
yields a log-like recovery behavior as
displayed in Fig. 7.12. As there are many different pairs of
and
within the device, their extraction from the experimental data is discussed
first.
By subtracting two recovery traces after stress times and
, the
fraction of defects with capture time constants with
is
determined first [116], which is shown in Fig. 7.13. By dividing the difference
trace into intervals
, the fraction of defects having
and
is obtained.
To be able to describe the frequency of occurrence of capture time constants
and emission time constants
properly, a large set of long recovery traces
with varying
is needed. The experiments performed cover
from
up to
and
intervals between
and
. This
allows for an extraction of the time constants as exemplarily depicted in
Fig. 7.14.
It is now possible to explain the above mentioned effect with the varying
oxide electric field on the basis of Fig. 7.15, where the fraction of due to
defects with
and
is plotted as smoothed surface over
and
.
For NBTI with an of
the surface shows two peaks.
One peak covers
and
smaller than
, while the other more
pronounced one clearly illustrates that the largest part of the degradation was
due to defects with
larger than
, which is highlighted by the
contour lines below the graph. When comparing the different
for
PBTI for
covering time constants between
and
, the
peak of
mainly consists of
, while it is widened for
towards smaller
. This supports the hypothesis of decreased
for higher
after PBTI stress, which appears as faster long-term
recovery.