The structure of a superjunction LDMOSFET (SJ-LDMOSFET) is shown in
Fig. 4.1. The whole structure is implemented on p-doped
silicon on insulator (SOI) with a p-doping concentration of
. The device contains a highly doped source
and drain where an additional p
-doping at the source contact is used to
avoid leakage current by removing holes in the p-body below the channel where
electrons and holes are generated thermally. If no highly doped p
-region
would be used the holes would flow to the n
-doped source and electrons
would be introduced to the p-body thus turning on parasitic bipolar transistor
action.
Superjunctions are formed in the n-drift region of the device by alternating n-
and p-doped columns. The structure shown in Fig. 4.1 can be
continued regularly in the -direction as shown in Fig. 4.2
where the simulated area is marked. Charge balance of the n- and p-columns
is achieved and the columns are fully depleted when the transistor is turned
off. The widths of the n- and p-columns are
, respectively.
The breakdown voltage is limited by the thickness of the buried oxide and the
drift layer length. The device has been designed to achieve a breakdown
voltage of
. Both, the buried oxide thickness and the SOI
thickness, are
.
For the following simulations the shown SJ-LDMOSFET is compared with a device
without superjunctions. For this device
simple two-dimensional simulations have been applied. Apart from the
superjunctions the device geometry is the same as for the SJ-LDMOSFET. For
comparison this conventional LDMOSFET device has also been designed to achieve
a breakdown voltage of
.
Robert Klima 2003-02-06