1.1 Simulation Tasks in Process Simulation

  The fabrication process can roughly be classified into two major groups of processes: (1) structural processing (etching, deposition, mask development), where the characteristics of the applied semiconductor materials are changed, and (2) thermal processing and doping (annealing, implantation), where the impurity profiles are manipulated. There are some processes which cannot be clearly classified, for example molecular beam epitaxy, which is used as deposition method to fabricate thin layers. By adding impurity particles to the beam doping of the layers can be achieved. Also the oxidation process effects the doping and the structure of the device. The following section gives a brief outlook on the state-of-the-art simulation methods used for the most critical process steps in a more or less hierarchical order.

• 1.1.1 Lithography
• 1.1.2 Etching and Deposition
• 1.1.3 Ion Implantation
• 1.1.4 Annealing
• 1.1.5 Oxidation