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2.1.1 Topography Processing

Manipulations of the semiconductor wafer's surface are necessary at several stages of IC manufacturing. Figure 2.2 depicts lithography-, etching-, and deposition treatments, which are applied to perform topography manipulations.
\begin{Figure} % latex2html id marker 1533\centering \includegraphics[width=0.... ... structured using lithography, etching, and deposition operations.} \end{Figure}



Rudi Strasser
1999-05-27