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Ion implantation causes damage, so called point defects, to the
crystal lattice of the semiconductor. Hence the crystal structure is
repaired by means of rapid thermal annealing (RTA). However, the
simulation of RTA is difficult, because the underlying diffusion
mechanisms are quite
complex [2,30,32,45,64,71]. At the
same time a correct modeling of these effects is desirable since they
are the cause for reverse short channel
effects [50,68,76] of MOS devices.
Rudi Strasser
1999-05-27