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A.5.3 GaAs

Due to its outstanding material properties (most notably the high low-field electron mobility of up to $80000\rm cm^2/Vs$) gallium-arsenide has been the great hope of high-performance computing for a long time. Unfortunately, not more than a hope, because of the high manufacturing costs and the practical restriction to n-channel devices, which in turn results in high power consumption (for similar reasons as in the case of ECL). Another reason why GaAs technology is not likely an option for future VLSI technology is its poor speed scalability, which is due to the electron saturation velocity \ensuremath{v_{\mathit{sat}}}, which is about the same as for silicon. This means that at small feature sizes silicon-based CMOS will catch up with the speed of GaAs digital circuits at a fraction of the cost.

Regarding low-power electronics GaAs still offers advantages over silicon CMOS and even bipolar circuits. Despite the feasibility of high-frequency circuits in CMOS technology the achievable noise figure is much lower for GaAs, owing to its high low-field electron mobility. In comparison to silicon BJT circuits which can achieve a certain noise figure the same can be done in GaAs at much lower power. However, comparable improvements are being achieved with SiGe hetero-junction components such as HEMTs and HBTs (high electron mobility transistors and hetero-junction bipolar transistors).


next up previous contents
Next: B. Sigma Delta Converters Up: A.5 Other IC Technologies Previous: A.5.2 Bipolar and BiCMOS

G. Schrom