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M. Bina, K. Rupp, S. Tyaginov, O. Triebl, and T. Grasser, ``Modeling of hot
carrier degradation using a spherical harmonics expansion of the bipolar
Boltzmann transport equation,'' in Technical Digest International
Electron Devices Meeting (IEDM), 2012.
(in print).
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M. Bina, O. Triebl, B. Schwarz, M. Karner, B. Kaczer, and T. Grasser,
``Simulation of reliability on nanoscale devices,'' in Proceedings
Simulation of Semiconductor Processes and Devices (SISPAD), pp. 109-112,
2012.
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S. Tyaginov, I. Starkov, O. Triebl, H. Ceric, T. Grasser, H. Enichlmair, J.-M.
Park, and C. Jungemann, ``Secondary generated holes as a crucial component
for modeling of HC degradation in high-voltage n-MOSFET,'' in Proceedings Simulation of Semiconductor Processes and Devices (SISPAD),
pp. 123-126, 2011.
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O. Triebl and T. Grasser, ``Numerical Power/HV device modeling,'' in Power/HVMOS Devices Compact Modeling (W. Grabinski and T. Gneiting, eds.),
ch. 1, pp. 1-32, Springer, 2010.
ISBN: 978-90-481-3045-0.
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S. Tyaginov, I. Starkov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello,
J.-M. Park, H. Enichlmair, M. Karner, C. Kernstock, E. Seebacher,
R. Minixhofer, H. Ceric, and T. Grasser, ``Interface traps density-of-states
as a vital component for hot-carrier degradation modeling,'' Microelectronics Reliability, vol. 50, no. 9-11, pp. 1267-1272, 2010.
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S. Tyaginov, I. Starkov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello,
J.-M. Park, H. Enichlmair, M. Karner, C. Kernstock, E. Seebacher,
R. Minixhofer, H. Ceric, and T. Grasser, ``Interface traps density-of-states
as a vital component for hot-carrier degradation modeling,'' in Proceedings European Symposium on Reliability Electron Devices, Failure
Physics and Analysis (ESREF), 2010.
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I. Starkov, S. Tyaginov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello,
J.-M. Park, H. Enichlmair, M. Karner, C. Kernstock, E. Seebacher,
R. Minixhofer, H. Ceric, and T. Grasser, ``Analysis of worst-case hot-carrier
conditions for high voltage transistors based on full-band Monte-Carlo
simulations,'' in Proceedings IEEE International Symposium on the
Physical and Failure Analysis of Integrated Circuits (IPFA), pp. 1-6,
2010.
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S. Tyaginov, I. Starkov, O. Triebl, J. Cervenka, C. Jungemann, S. Carniello,
J.-M. Park, H. Enichlmair, M. Karner, C. Kernstock, E. Seebacher,
R. Minixhofer, H. Ceric, and T. Grasser, ``Hot-carrier degradation modeling
using full-band Monte-Carlo simulations,'' in Proceedings IEEE
International Symposium on the Physical and Failure Analysis of Integrated
Circuits (IPFA), pp. 1-5, 2010.
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I. Starkov, S. Tyaginov, H. Enichlmair, O. Triebl, J. Cervenka, C. Jungemann,
S. Carniello, J.-M. Park, H. Ceric, and T. Grasser, ``HC degradation model:
interface state profile - simulations vs. experiment,'' in Book of
Abstracts Workshop on Dielectrics in Microelectronics (WODIM), p. 128,
2010.
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P. Hehenberger, T. Aichinger, T. Grasser, W. Gös, O. Triebl, B. Kaczer, and
M. Nelhiebel, ``Do NBTI-induced interface states show fast recovery? A
study using a corrected on-the-fly charge-pumping measurement technique,'' in
Proceedings IEEE International Reliability Physics Symposium
(IRPS), pp. 1033-1038, 2009.
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H. Kosina, O. Triebl, and T. Grasser, ``Box method for the convection-diffusion
equation based on exponential shape functions,'' in Proceedings
Simulation of Semiconductor Processes and Devices (SISPAD), vol. 12,
pp. 317-320, 2007.
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O. Triebl and T. Grasser, ``Vector discretization schemes in technology CAD
environments,'' Romanian Journal of Information Science and Technology,
vol. 10, no. 2, pp. 167-176, 2007.
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O. Triebl and T. Grasser, ``Investigation of vector discretization schemes for
box volume methods,'' in Proceedings NSTI-Nanotech, vol. 3, pp. 61-64,
2007.
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R. Entner, T. Grasser, O. Triebl, H. Enichlmair, and R. Minixhofer, ``Negative
bias temperature instability modeling for high-voltage oxides at different
stress temperatures,'' Microelectronics Reliability, vol. 47, no. 4-5,
pp. 697-699, 2007.
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O. Triebl and T. Grasser, ``Vector discretization schemes based on unstructured
neighborhood information,'' in Proceedings International Semiconductor
Conference (CAS), vol. 2, pp. 337-340, 2006.
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T. Grasser, R. Entner, O. Triebl, H. Enichlmair, and R. Minixhofer, ``TCAD
modeling of negative bias temperature instability,'' in Proceedings
Simulation of Semiconductor Processes and Devices (SISPAD), pp. 330-333,
2006.
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M. Wagner, G. Span, S. Holzer, V. Palankovski, O. Triebl, and T. Grasser,
``Power output improvement of silicon-germanium thermoelectric generators,''
in SiGe and Ge: Materials, Processing, and Devices, vol. 3,
pp. 1151-1162, ECS Transactions, 2006.
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M. Wagner, G. Span, S. Holzer, O. Triebl, and T. Grasser, ``Power output
improvement of SiGe thermoelectric generators,'' in Abstracts Joint
International Meeting of the Electrochemical Society (ECS), p. 1516, 2006.
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O. Triebl, ``Verfolgen von teilweise verdeckten Kanten mit Hilfe von
Suchlinien,'' Master's thesis, Technische Universität Wien, 2005.
Next: Curriculum Vitae
Up: Dissertation Oliver Triebl
Previous: Bibliography
O. Triebl: Reliability Issues in High-Voltage Semiconductor Devices