2.8 SiC Device Packaging

SiC semiconductor devices and integrated circuits are of little advantage, if they cannot be reliably packaged and connected to form a complete system capable of hostile-environment operation. With proper materials selection, modifications of existing IC packaging technologies appear feasible for non-power SiC circuit packaging up to 300$~^{\circ}$C [99,100]. Prototype electronic packages that can withstand over a thousand of hours heat soaking without electrical bias at 500$~^{\circ}$C have been demonstrated [101,102]. Much work remains before electronics system packaging can meet the needs of the most demanding aerospace electronic applications, whose requirements include high power operation in high vibration $500-600$$~^{\circ}$C oxidizing-ambient environments. Similarly, harsh environment passive components, such as inductors, capacitors, and transformers, must also be developed for operation in demanding conditions before the full system-level benefits of SiC electronics can be successfully realized.

T. Ayalew: SiC Semiconductor Devices Technology, Modeling, and Simulation