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1.6 Scope of the Dissertation
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Dissertation Tesfaye Ayalew
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2.1 SiC Material Properties
2
. SiC Technology
Subsections
2
.
1
SiC Material Properties
2
.
1
.
1
Crystallography
2
.
1
.
2
Electrical Properties
2
.
2
SiC Device Applications
2
.
2
.
1
High Temperature Device Operation
2
.
2
.
2
High Power Device Operation
2
.
2
.
3
High Frequency Device Operation
2
.
2
.
4
Optoelectronic Device Operation
2
.
3
SiC Semiconductor Crystal Growth
2
.
3
.
1
Historical Lack of Wafers
2
.
3
.
2
Sublimation Growth of Wafers
2
.
3
.
2
.
1
Commercially Available Wafers
2
.
3
.
2
.
2
Wafer Crystal Defects
2
.
3
.
3
Epitaxy
2
.
3
.
3
.
1
Epitaxial Growth
2
.
3
.
3
.
2
Homoepitaxial Growth
2
.
3
.
3
.
3
Epilayer Doping
2
.
3
.
3
.
4
Epilayer Crystal Defects
2
.
3
.
3
.
5
Commercially Available Epilayers
2
.
4
SiC Device Fundamentals
2
.
4
.
1
Choice of Polytype for Devices
2
.
4
.
2
Selective Doping- Ion Implantation
2
.
5
SiC Contacts and Interconnect
2
.
5
.
1
Ohmic Contacts
2
.
5
.
2
Schottky Contacts
2
.
6
SiC Patterned Etching
2
.
7
SiC Insulators
2
.
8
SiC Device Packaging
 
Previous:
1.6 Scope of the Dissertation
Up:
Dissertation Tesfaye Ayalew
Next:
2.1 SiC Material Properties
T. Ayalew: SiC Semiconductor Devices Technology, Modeling, and Simulation