List of Figures

1.1. The PIF low level library stack.
1.2. Example point list as used in PIF ASCII files.
1.3. Example line list as used in PIF ASCII files.
1.4. The PIF high level library stack.
1.5. Different interface types.
2.1. Data in a persistent Wafer
2.2. Example Wafer. Geometry and mesh of one half of an HBT device.
2.3. Two-dimensional merge operation after an etch-step.
2.4. Data flow for a mixed mode device simulation.
2.5. Concept of the WAFER-STATE-SERVER.
2.6. Public interface classes of the WAFER-STATE-SERVER
3.1. Configuration of attribute type concentrations.
3.2. Relation between quantity values, grid elements and point coordinates.
3.3. I/O reading algorithm.
3.4. I/O writing algorithm.
3.5. UML reading class diagram.
3.6. UML writing class diagram.
3.7. Scanning of points with different dimension.
3.8. Scanning of dimension dependent grid elements using a semantical predicate.
3.9. Definition of WafGridEl struct.
3.10. Gridding algorithm.
3.11. UML diagram of Gridder.
3.12. Node/leaf hierarchy of an oct-tree.
3.13. Cuboidal region.
3.14. Resulting leaf structure for cuboidal region.
3.15. Jump and walk algorithm.
3.16. Disadvantageous two-dimensional grid for the jump-and-walk search algorithm.
3.17. Disadvantageous three-dimensional grid for the jump-and-walk search algorithm.
3.18. Mesh and resulting quad-tree structure of a triangulated rectangle.
3.19. Concept of the handle class.
3.20. Assignment of handles.
3.21. Static pool class.
3.22. Dynamic pool class.
4.1. CMOS structure for well and threshold adjust implantation examples.
4.2. Front and back view of a well implant.
4.3. Front and back view of a threshold voltage adjust implant.
4.4. CMOS structure for LDD implantation example.
4.5. LDD implant.
4.6. Initial tetrahedralization.
4.7. Mesh after first two recursion steps.
4.8. Final refinement result.
4.9. Two-dimensional example of geometrical similarities occurring during recursive mesh refinement.
4.10. Original mesh - negative concentrations emerge during the simulation.
4.11. Adaptively refined mesh - negative concentrations have not occurred.
4.12. Original coarse mesh.
4.13. Final mesh. Refinement is restricted to the gate region.
4.14. Illustration of cellular discretization process.
4.15. Selective anisotropic etching process.
4.16. Detailed view of Fig. 4.15
4.17. Fill of STI trenches.
5.1. TCAD optimization task.
5.2. Device Model for Inverse Modeling.
5.3. Calibration of a mobility model with the SIESTA framework.
5.4. Model architecture of SIESTA.
5.5. Screen shot of the QUEUE-MANAGER module of the framework SIESTA.
5.6. Swing QUEUE-MANAGER GUI.
5.7. Coupling of SIESTA and the CORBA client stubs.
5.8. IDL definition of the struct HostStruct which is used in the communication between the QUEUE-MANAGER and the GUI.
5.9. IDL definition of the interface ClientRequest
5.10. IDL definition of the interface ClientUpdate
5.11. Binary representation of a genome.
5.12. Population and representation of a dimensional optimization problem.
5.13. Different crossover methods in genetic algorithms.
5.14. Generation probability density.
5.15. Acceptance function.
5.16. Progress of the gradient based optimizer.
5.17. Evolution of the genetic optimizer.
5.18. Evolution of the genetic optimizer.
5.19. Evolution of the simulated annealing optimizer.
5.20. Optimizer protocol. The optimizer requests the evaluation for a given list of parameters.
5.21. Optimizer protocol. SIESTA returns the error vector to the optimizer.
5.22. Optimizer protocol. Optimizer truncation criterion is fulfilled.
5.23. Pipe mechanism to combine two optimizers.
. Combination of very fast simulated re-annealing with a gradient-based optimizer.
. Better combination of very fast simulated re-annealing and a gradient-based optimizer.
. Combination of very fast simulated re-annealing and a gradient-based optimizer to reach best target value.
5.27. Silicon self-interstitial density as a function of time.
5.28. Deviation of measured and computed cluster concentration.
5.29. Progress of combined optimizer.
5.30. Progress of combined optimizer.
A.1. Instantiation of Config and Reader objects.
A.2. Instantiation of Wafer object.
A.3. Instantiation of Writer object.
A.4. Dumping the data of a Wafer to a file.
A.5. Updating points of aWafer attribute.
A.6. Usage of interface AttributeUpdater.
A.7. Updating a refined Wafer.
A.8. Updating a deformed Wafer.
A.9. Segment related methods of Wafer class.
A.10. Definition of the surface class.
A.11. Surface related methods of Wafer class.
A.12. General methods of Wafer class.
A.13. Access methods to data stored on segments.
A.14. Methods to modify data stored on segments.
A.15. Methods to query data stored on attributes.
A.16. Data and methods of the Quantity class.
A.17. Interface between two segments.
A.18. Map to translate a geometrical point into a Wafer point.
B.1. Basic WSS grammar elements.
B.2. Syntax of INFO section.
B.3. Sample INFO section of a WSS file.
B.4. The POINTS section.
B.5. Syntax definition of SEGMENTS section.
B.6. Syntax definition of ATTRIBUTES section.
B.7. Syntax definition of BOUNDARIES section.
B.8. Cube to illustrate the WSS syntax.
B.9. Attrkeywords section of the Config file.
C.1. Configuration of software packages to test

2003-03-27


Previous: Contents Up: Dissertation Thomas Binder Next: List of Tables