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3. The Silicon/Silicon-Dioxide Interface

ONE of the most important things that led to the enormous success and continuous improvement of the CMOS technology are the excellent properties of the thermally grown \ensuremath {\textrm {Si/SiO$_2$}} interface. The quality and abruptness of the interface is of high quality and it has a very low defect density [15].

The amorphous \ensuremath {\textrm {SiO$_2$}} is grown on a pure silicon crystal. The lattice mismatch between those two materials is rather large, but the highly flexible angle of the Si-O-Si bond can compensate for a major part of this mismatch. The remaining, unbound silicon atoms at the interface form the prevalent imperfection of the interface, the silicon dangling bonds.



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Next: 3.1 Silicon Dangling Bonds Up: Dissertation Robert Entner Previous: 2.4 Quantum Mechanical Effects

R. Entner: Modeling and Simulation of Negative Bias Temperature Instability