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1.1 Traditional Semiconductor Process Technologies

The fabrication of silicon-based IC begins with a uniformly doped silicon wafer. A set of sequential processing steps generates the required geometries in order to obtain a desired device. The most commonly used processing steps for IC fabrication are lithography, etching, deposition, CMP oxidation, ion implantation, and diffusion. Those processes are briefly discussed in this section.


Subsections
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L. Filipovic: Topography Simulation of Novel Processing Techniques