Symbol |
| Unit |
| Description |
|
| Areal gate oxide capacitance | ||
|
| Activation energy | ||
|
| Binding energy | ||
|
| Thermally activated barrier | ||
|
| Conduction bandedge energy | ||
|
| Fermi energy | ||
|
| Oxide electric field | ||
|
| Electric field at the surface | ||
|
| Valence bandedge energy | ||
|
| Energy of defect state | ||
|
| Energy difference | ||
|
| Energy barrier for the metastable transition | ||
|
| Energy barrier for the transition | ||
|
| Relative permittivity | ||
|
| Transconductance | ||
|
| Charge pumping current | ||
|
| Drain current | ||
|
| Initial drain current | ||
|
| Drain current shift | ||
|
| Linear drain current | ||
|
| Drain current criterion | ||
|
| Forward transition rate | ||
|
| Reverse transition rate | ||
|
| Transition rate for | ||
|
| Gate length | ||
|
| Effective mobility | ||
|
| Number of interface states per area | ||
|
| Number of oxide traps per area | ||
|
| Effective valence band weight | ||
|
| Interface charge per area | ||
|
| Oxide charge per area | ||
|
| Surface charge density | ||
|
| Reaction coordinate equilibrium of state | ||
|
| Relaxation energy | ||
|
| Cross section of holes | ||
|
| Capture time constant | ||
|
| Emission time constant | ||
|
| Measurement delay time | ||
|
| Oxide thickness | ||
|
| Pulse period | ||
|
| Relaxation time | ||
|
| Stress time | ||
|
| Drain voltage | ||
|
| Gate voltage | ||
|
| Gate relaxation voltage | ||
|
| Gate stress voltage | ||
|
| Adiabatic potential of state | ||
|
| Threshold voltage | ||
|
| Initial threshold voltage | ||
|
| Threshold voltage shift | ||
|
| Thermal velocity of holes | ||
|
| Threshold voltage after the compact model | ||
|
| Threshold voltage shift after the compact model | ||
|
| Threshold voltage shift by means of OTF,x | ||
|
| Gate width | ||
|
| Vibronic frequency of state | ||
|
| Oxide trap depth (referenced to interface) | ||