In order to be able to verify the NMP model for the experimental results, inverse modeling is necessary. This is done via -characteristics of the real device. Unfortunately, the doping profile of the completely processed pMOSFET was not accessible. To incorporate the quite complex NMP model a representative 1D doping profile has to be guessed1 . Since the background doping is small and all the layers below the interface of the pMOSFET are not additionally doped during the fabrication process, diffusion from the source/drain regions towards the SiGe quantum well can take place. Due to many annealing steps the resulting doping becomes complicated which makes the calibration of the simulated layer structure with the proper layer thicknesses and their corresponding dopings an extremely challenging task.
Due to the fact that only a very limited amount of mobility data for SiGe-layers was published so far the mobilities are only roughly approximated and are furthermore considered as constant within the single layers. Based on the measured mobilities of Si and Ge in [166, 167, 168, 89], the values for the layers were linearly interpolated for . The used values of are given in Tab. 9.1 for all layers at a temperature of .
Despite this approximation the finally obtained -characteristics of the 1D device catches the trend of the measurement, cf. Fig. 9.2, and fits the experimental split- very well in the inversion regime. The decrease of the capacitance above is due to dominant gate leakage. Below the gate dielectric starts to break down due to the low effective oxide thickness of about . Since the NBTI stress conditions dealt with in this chapter are well within this regime, the deviations outside this regime are assumed to be unimportant.