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The fabrication of an IC requires hundreds of sequential process steps
containing [19] [70] :
- Lithography
- Etching
- Deposition
- Chemical Mechanical Polishing
- Oxidation
- Ion Implantation
- Diffusion
Starting with a uniformly doped silicon wafer the production process can be
subdivided into three phases.
- The generation of the active devices (front-end processing).
- The definition of the contacts and interconnects (back-end processing).
- The packing of the IC.
For each production phase several process steps are applied.
Subsections
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A. Hoessiger: Simulation of Ion Implantation for ULSI Technology