Next: 5.3.1 Thermal Analysis of Up: 5. Applications Previous: 5.2.3 Results Contents
The parameters which have been extracted in the previously shown examples have been applied to more complex structures and provide a better insight into the electro-thermal behavior of fairly complex interconnect structures. This is the basis for further simulations to obtain an accurate temperature distribution for rigorous investigation of the mechanical stress distribution and consequently also for electromigration analysis.