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8.2.4 Two-Dimensional Cross Sections of the Printed Contact Holes



  
Figure 8.27: Cross sections of the resist profiles of the contact holes printed over a planar silicon substrate (upper: coherent, middle: circular, lower: quadrupole; left: best focus, right: 1 $ \mu$m defocus above).
\resizebox{14.8cm}{!}{\psfrag{xlab}{$x$\space [$\mu$ m]}
\psfrag{zlab}{$z$\space...
... 309 nm}
\psfrag{18.9}{\footnotesize 290 nm}
\includegraphics{REcutsPlanar.eps}}






  
Figure 8.28: Cross sections of the resist profiles of the contact holes printed over a dielectric oxide step (upper: coherent, middle: circular, lower: quadrupole; left: best focus, right: 1 $ \mu$m defocus above).
\resizebox{14.8cm}{!}{\psfrag{xlab}{$x$\space [$\mu$ m]}
\psfrag{zlab}{$z$\space...
...ze 272 nm}
\psfrag{18.3}{\footnotesize 281 nm}
\includegraphics{REcutsDiel.eps}}






  
Figure 8.29: Cross sections of the resist profiles of the contact holes printed over a reflective a-silicon step (upper: coherent, middle: circular, lower: quadrupole; left: best focus, right: 1 $ \mu$m defocus above).
\resizebox{14.8cm}{!}{\psfrag{xlab}{$x$\space [$\mu$ m]}
\psfrag{zlab}{$z$\space...
...ze 270 nm}
\psfrag{18.0}{\footnotesize 277 nm}
\includegraphics{REcutsRefl.eps}}




Heinrich Kirchauer, Institute for Microelectronics, TU Vienna
1998-04-17