List of Symbols

Chapter 3: Stochastic Model of the Resistive Switching
Ae

dimensionless coefficient for electrons

Ai

dimensionless coefficient for ions

a

localization radius

Ea

annihilation energy of the mth vacancy V o

Ef

threshold energy for the mth vacancy V o

ΔE

difference between the energies of an electron positioned at sites n and m

ΔE

difference in energy of an ion after and before hopping

d

x-dimension of system

reduced Planck constant

I

current generated by hopping

kB

Boltzmann constant

qe

electron charge

Rnm

hopping distance for electrons

T

local temperature

t

the time spent for moving a single particle (electron or ion)

U

applied voltage

Δx

difference between the x coordinate of the sites (vacancies) m and n

α

coefficients of the boundary conditions on the cathode

β

coefficients of the boundary conditions on the anode

Γnm

hopping rates from site n to site m for electrons

Γ0miC

hopping rates from an electrode site 0 to an oxygen vacancy m

Γm0oC

hopping rates from an oxygen vacancy m to an electrode site 0

Γ(2N)miA

hopping rates from an electrode site 2N to an oxygen vacancy m

Γm(2N)oA

hopping rates from an oxygen vacancy m to an electrode site 2N

Γn

hopping rates for ions

Chapter 4: Magnetoresistive Memory
Eb

energy barrier that separates the two magnetization state

e

electron charge

Acs

cross-section area of the free layer

HK

effective anisotropy field

HKin-plane

effective anisotropy field for in-plane MTJ

HKperp

effective anisotropy field for perpendicular MTJ

reduced Planck constant

Ic

switching (critical) current

Icin-plane

critical currents for in-plane MTJ

Icperp

critical currents for perpendicular MTJ

kB

Boltzmann constant

MS

saturation magnetization of the free layer

RAP ,RP

resistances in HRS and LRS, respectively

T

temperature

V

volume of the free layer

α

Gilbert damping parameter

Δ

thermal stability factor

Δin-plane

thermal stability factor for in-plane MTJ

Δperp

thermal stability factor for perpendicular MTJ

η

polarizing factor

μ0

magnetic constant

ρAP ,ρP

resistivities in HRS and LRS, respectively

σAP ,σP

conductivities in HRS and LRS, respectively

Chapter 5: Macro- and Micromagnetic Approach
A

material exchange constant

a(j)

time-dependent current-proportional function for the in-plane torque

b(j)

time-dependent current-proportional function for the perpendicular torque

d

thickness of the free layer

Eani

magnetocrystalline anisotropy energy

Ecurrent

energy associated with Ampere field

Edemag

demagnetization energy

Eexch

exchange energy

Eext

energy associated with external magnetic field

Ems

energy associated with magnetostatic coupling between the reference layer and the free layer

Eth

energy thermal field

e

electron charge

g

g-factor

g(Θ)

Slonczewski’s expression for spin-torque

Hani

magnetocrystalline anisotropy field

Hcurrent

Ampere field

Hdemag

demagnetization field

Heff

effective magnetic field

Hexch

exchange field

Hext

external magnetic field

Hms

magnetostatic coupling between the reference layer and the free layer

Hth

thermal field

reduced Planck constant

J

current density vector

j

current density

K1,K2

material anisotropy coefficient

M

magnetization of the free layer

MS

saturation magnetization of the free layer

MSp

saturation magnetization of the reference layer

m

magnetization unit vector of the free layer

me

electron mass

mx,my,mz

projection of m on x, y, and z axes, respectively

p

magnetization unit vector of the reference layer

T

temperature

V

volume of the free layer

α

Gilbert damping parameter

β

coefficient of the perpendicular torque

γ

gyromagnetic ratio

δ

Dirac delta function

ε

energy density

η

polarizing factor

Θ

angle between direction of magnetization of the free and fixed layer

λ

phenomenological damping parameter

μ0

magnetic constant

μB

Bohr magneton

ρ

volume magnetic charge

σ

surface magnetic charge

τ

spin transfer torque term

Φd

scalar potential of the stray field

Chapter 6: Numerical Implementation of Micromagnetic Approach
A

material exchange constant

Eani(i,j,k)

magnetocrystalline anisotropy energy of the cell (i,j,k)

Ecell(i,j,k)

full energy of the cell (i,j,k)

Ecurrent(i,j,k)

energy of the cell (i,j,k) associated with Ampere field

Edemag(i,j,k)

demagnetization energy of the cell (i,j,k)

Eexch(i,j,k)

exchange energy of the cell (i,j,k)

Eext(i,j,k)

energy of the cell (i,j,k) associated with external magnetic field

Ems(i,j,k)

energy associated with magnetostatic coupling between the reference layer and the cell (i,j,k)

Eth(i,j,k)

energy of the cell (i,j,k) associated with thermal field

Etot

total energy of the free layer

Hani(i,j,k)

magnetocrystalline anisotropy field of the cell (i,j,k)

Hcurrent(i,j,k)

Ampere field of the cell (i,j,k)

Hdemag(i,j,k)

demagnetization field of the cell (i,j,k)

Heff(i,j,k)

effective magnetic field of the cell (i,j,k)

Hexch(i,j,k)

exchange field of the cell (i,j,k)

Hext(i,j,k)

external magnetic field influences on the cell (i,j,k)

Hms(i,j,k)

magnetostatic coupling between the reference layer and the cell (i,j,k)

Hth(i,j,k)

thermal field influences on the cell (i,j,k)

J(i,j,k)

current density vector, current flows through the cell (i,j,k)

K1,K2

material anisotropy coefficient

kB

Boltzmann constant

M

magnetization of the free layer

MS

saturation magnetization of the free layer

MSp

saturation magnetization of the reference layer

m(i,j,k)

magnetization unit vector of the cell (i,j,k)

mx, my, mz

projection of m on x, y, and z axes, respectively

Nx, Ny, Nx

grid dimension in x, y, z direction, respectively

p

magnetization unit vector of the reference layer

T

temperature

Δt

time step

ΔV

volume of the cell

Δx, Δy, Δz

x, y, z dimensions of the cell

μ0

magnetic constant

σ(i,j,k)

Gaussian random uncorrelated function with standard deviation equal 1