We present two contact structures, where a titanium nitride barrier layer is used to insulate metallurgically the metal from the semiconductor. In Figure 7.9 we show SEM pictures after a TiN deposition into a 1.0 circular hole located 260mm below the center of the sputter target disk (see Figure 7.8-(i)) and when the deposition of TiN is made at a position 90mm off the wafer center (see Figure 7.8-(ii)). The picturesures in Figure 7.10 are cuts from the simulated three-dimensional structures and agree well with the upper SEMs.
In figure 7.11 we show the current density in the contacts for both cases, after being filled with aluminium. The effect of the asymmetry in the TiN layer in the current density is clearly seen. In case (ii) the current flows mainly in unusual areas, namely in the trailing edge of the contact, whereas in the other case we have the known current crowding effect at the opposite edge.
As electromigration problems are worsened by current crowding effects [90], our tools can be used to understand and minimize this unwanted phenomena. The resistance values obtained were 0.77 and 0.89 for the upper and lower cases respectively, and agree well with the experiments.