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Acronyms

 
  ASCII 		          American Standard Code for Information Interchange

BFGS Broyden-Fletcher-Goldfarb-Shanno

BPFL Berkeley Process Flow Language

CAD Computer-Aided Design

CAD Computer-Aided Manufacturing

CFI CAD Framework Initiative

CIM Computer-Integrated Manufacturing

CMOS Complementary MOS

CMP Chemical Mechanical Polishing

CPU Central Processing Unit

CVD Chemical Vapor Deposition

DoE Design of Experiments

ECAD Electronic CAD

EVE Evaluable Entity

EVI Evaluation Instance

GUI Graphical User Interface

HDX Hierarchical Data Exchange

IC Integrated Circuit

LAT Large-Angle Tilt

LDD Lightly Doped Drain

LISP List Processing

LM Levenberg-Marquardt

LOCOS Local Oxidation of Silicon

MOS Metal-Oxide-Semiconductor

NFS Network File System

PAI PIF Application Interface

PAL PIF Application Layer

PBFM PIF Binary File Manager

PED PIF Editor

PFR Process Flow Representation

PIF Profile Interchange Format

PIL PIF Interface Layer

PLB PIF Logical Binary File

PVD Physical Vapor Deposition

RIE Reactive Ion Etching

RPC Remote Procedure Call

RSM Response Surface Model

SFC Simulation Flow Control

SIMS Secondary Ion Mass Spectrometry

SPR Semiconductor Process Representation

SRP Spreading Resistance Profiling

STI System Tool Interface

SVG Simple Vector Graphics

SWR Semiconductor Wafer Representation

TAC Tool Abstraction Concept

TCAD Technology CAD

TIF Technology Interchange Format

VISTA Vienna Integrated System for TCAD Applications

VLISP Vienna LISP

VLSI Very Large Scale Integration

VOS Vienna Operating System

VUI Vienna User Interface

WWW World Wide Web



Christoph Pichler
Thu Mar 13 14:30:47 MET 1997