Part : Appendices

Subsections

• A. Validation of the analytic common-mode coupling factor d/h
  • A.1 Variation of the trace position
  • A.2 Variation of the enclosure height and the trace height above the ground plane, comparisons of the transfer impedance for parallel planes with four open edges and comparison of the transfer impedance for the two different trace routings in Figure 5.7

C. Poschalko: The Simulation of Emission from Printed Circuit Boards under a Metallic Cover