A. Validation of the analytic common-mode coupling factor d/h

This appendix contains an empirical validation of the analytical coupling factor with HFSS^® simulations. Each figure depicts a comparison of two HFSS^® simulation results. One of these two simulations was performed with ports between the parallel planes, the other simulation, with a trace. The transfer impedance from the source at the trace to the ports at the slot of the enclosure is obtained directly from the HFSS^® model with the trace. For the comparison the transfer impedance is obtained by application of the trace introduction method using equations (5.6), (5.9) and the impedance matrix from the HFSS^® simulation with the ports between the enclosure cover and bottom. Section 5.3 contains a more detailed description of the validation procedure.

Subsections

• A.1 Variation of the trace position
• A.2 Variation of the enclosure height and the trace height above the ground plane, comparisons of the transfer impedance for parallel planes with four open edges and comparison of the transfer impedance for the two different trace routings in Figure 5.7

C. Poschalko: The Simulation of Emission from Printed Circuit Boards under a Metallic Cover