The aircraft (top pictures) and the 2D MOSFET (middle pictures) have one reflective symmetry with a vertical reflecting hyperplane. The 3D FinFET (bottom pictures) has two reflective symmetries with reflecting hyperplanes which are orthogonal to each other. While the aircraft geometry does not have any regions, the 2D MOSFET and the 3D FinFET geometry have multiple regions (indicated by different colors) which reflect different material properties. |
The left and right column shows runtime and memory benchmarks, respectively, for different objects and for varying cell counts. Expected savings (visualized by the green lines) are a factor two for the 2D aircraft and 3D MOSFET (both having one reflective symmetry) and a factor of four for the 3D FinFET (having two reflective symmetries). |
In contrast to Figure 7.2 memory savings of the templated mesh are calculated based on the memory requirement of its structure instance rather than a (non-symmetric) conventionally generated mesh of the same geometry. The expected savings are visualized by green lines. |
The mesh has been generated with a desired smallest angle of . However at the wing and the end of the aircraft this element quality constraint cannot be achieved due to sharp angles in the input geometry (top picture). All other elements fulfill the desire element quality. The smallest angle quality histograms of the symmetric mesh (middle picture) and non-symmetric mesh (bottom picture) show, that for the non-symmetric mesh slightly more elements have a quality worse than configured (visualized by the red bins). The histogram bins are given in log scale for better visualization of the bad quality bins. |
florian 2016-11-21