For the drive current optimizations following the two-dimensional optimization approach 62 optimization parameters are used to describe the doping profile as shown earlier in Fig. 3.4. Each of these parameters represents the logarithm of the doping value at one of the optimization grid points. For the constant background substrate doping a value of 10 cm is used.
In Listing 4.5 the parts of the device generation sub-model mkdev.mod are shown which define the substrate doping parameter Nsub as well as the initial values and bounds of the optimization parameters for Device Generation A and Device Generation B. The doping parameter K06_01, for example, belongs to the grid point in row 6, column 1 of the grid shown in Fig. 3.4. The optimization starts with a uniformly doped inverted-T region with an acceptor doping of 10 cm for Device Generation A and 10 cm for Device Generation B. The allowed range for each parameter lies within 10 cm and 10 cm.
The Knots section in the Makedevice input deck is given in Listing 4.6. The doping parameters are given in a matrix K which defines the doping in a rectangular box at the semiconductor surface. The inverted-T region is embedded in this rectangle. Matrix entries outside the inverted-T region are set equal to the substrate doping .
Fig. 4.3 shows the improvement in drive current during the optimization procedure for both device generations. The values are taken at each temporary minimum which is the last evaluation step before a gradient calculation as shown earlier in Fig. 3.8. The constraint was fulfilled at any time keeping the leakage current at 1 pA. It should be noted that the superior drive current of Device Generation A results from the higher supply voltage of 1.5 V compared to 0.9 V of Device Generation B.
During the whole optimization procedure more than 5000 device simulations had to be performed, most of them were gradient steps and took only a few seconds due to the very good initial solution provided. Anyway, an optimization like this with such a very large number of optimization parameters and simulation jobs claims considerable computational resources which can only be provided by a workstation cluster of high-speed machines. Assuming that, one optimization procedure like this can be finished within a few hours up to one day.
Fig. 4.4 and Fig. 4.5 show the acceptor doping profiles as results of the two-dimensional optimization approach for Device Generation A and Device Generation B, respectively. These doping profiles look quite complex due to the numerical nature of the optimization procedure. The optimizer just handles a black box with input parameters delivering the target and the constraint (see Fig. 3.1). As a matter of fact, the influence of each parameter on the performance of the device varies, some have more influence, the others less. Therefore, parameters with very little influence can end up with almost arbitrary values.