The drive current improvements for the various optimizations performed are summarized in Table 4.4. The performance gains given refer to uniformly doped devices with a bulk doping concentration of 5.4710cm and 2.3910 cm for Device Generation A and Device Generation B, respectively. In this table the optimization results using a one-dimensional approach in the vertical direction are shown, too.
Device Generation A | Device Generation B | |||
device | (A) | perf. gain | (A) | perf. gain |
uniformly doped | 258.5 | - | 130.8 | - |
one-dimensional vertical | 290.3 | 12.3% | 176.4 | 34.9% |
two-dimensional | 373.7 | 44.6% | 224.2 | 71.4% |
one Gaussian function | 369.3 | 42.9% | 214.0 | 63.6% |
two Gaussian functions | 373.2 | 44.4% | 222.5 | 70.1% |
Fig. 4.12 shows the vertical doping profiles after the one-dimensional optimization for both Device Generation A and Device Generation B. In this case only vertical doping variations were allowed in the inverted-T region already used for the two-dimensional approach. The resulting profiles consist of a doping layer close to the silicon surface which sets the threshold voltage and a buried layer under the source and drain wells preventing punchthrough.
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It is clearly demonstrated that the complex results from two-dimensional optimizations can successfully be substituted by Gaussian functions without a substantial performance loss. This does not mean that the two-dimensional optimizations are useless. It rather means that the core information about how to improve the device performance is delivered by the two-dimensional approach. Based on this information, Gaussian functions can be introduced to make the doping profiles smooth.
The difference in performance gain between Method 1 and Method 2 is rather small, especially for Device Generation A, and might not justify the additional effort of a second Gaussian function.
For both device generations the doping peak in the channel region is almost identical when comparing Method 1 and Method 2. This indicates that they are equivalent techniques to prevent punchthrough.