InAlN/GaN HEMTs have been proposed to provide higher polarization charges without the drawback of high strain [62]. Several groups have demonstrated devices based on InAlN/GaN [390,391] with maximum current capabilities surpassing those of AlGaN/GaN structures.
Optimization of the structures has been carried out by using analytical models [62]. In order to fully develop the potential of the device, proper modeling of the materials is required. Based on the material parameters discussed in Chapter 4, a simulation study is conducted. The HEMT structures described in [391] and [392] are used to benchmark the DC and AC simulation results against measured data. A schematic layer structure of the investigated InAlN/GaN device [392] is shown in Fig. 5.40. All layers are non-intentionally doped.
A band gap bowing factor of 3 eV is assumed for InAlN as discussed in Section 4.3.1. This yields a band gap of 4.58 eV for InAlN at 300 K (Fig. 5.41). The values for the band offsets are E =0.66 eV and =0.59 eV, corresponding to a 53%/47% setup.
The calculated dielectric permittivity of InAlN is =9.86, which is in a good agreement with the value listed in [392]. The barrier height of the gate Schottky contact is 1 eV. The value of the sheet charge density at the InAlN/GaN interface induced by the polarization effects is found to be 3.310 cm from the DC characteristics (simulation results for different values are given in Fig. 5.42).
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A commensurate negative surface charge (as the device is not passivated, a low value of 10 cm is assumed) at the top of the InAlN surface is also considered in the simulation. Simulation results for the transfer characteristics assessing different charge values are shown in Fig. 5.43.
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Self-heating effects are accounted for by using a thermal resistance of R =3 K/W at the substrate thermal contact. Fig. 5.44 compares transfer characteristics without self-heating effects and with different values of R . This value lumps the thermal resistance of the nucleation layer and the sapphire substrate, and possible three-dimensional thermal effects.
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The simulation exhibits good agreement with the experimental data under consideration of Ohmic contact resistances R =R =1.3 mm. The simulated output characteristics show a good agreement with the experimental data (Fig. 5.45).
By AC analysis of the device a cut-off frequency 7 GHz is obtained. This low value can be explained with the conservative design of the device and the low carrier mobility in the channel (=230 cm/Vs). Downscaled devices are analyzed ( ) and the effect of higher quality GaN material on the AC performance is studied. In our simulation of a device with reported in [391] (carrier mobility =530 cm/Vs) =36 GHz is reached.