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Here we present some results of the application of the methods described
previously. We start with a medium size layout and a conventional imaging
system: Figure 3.13-(i) depicts the aerial image of mask
METAL2 of the layout in Figure 3.2. The simulated
imaging system uses a lens with a numerical aperture NA of 0.55, a wavelength
of 365nm (I-line) and the focus error is
.
The resulting
binary mask is shown in Figure 3.13-(ii). The simulation
time for this relatively large example is only five minutes onn
a DEC-600 workstation.
In the second example phase-shift masks are
used. Figure 3.14 shows
simulation results of one layout with nested
elbows and minimum feature size of 0.4
m. We compare conventional
binary masks (left) with alternating phase-shifting masks (right). The
simulation parameters are: Numerical aperture of
,
a
wavelength of also 365nm (I-line), and a focus error
of
.
Figure 3.14-bottom demonstrates the
superior performance of phase-shifting masks.
Figure 3.13:
Lithography simulation of the layout in
Figure 3.2 (layer METAL2): (i) -
Aerial image; (ii) - Resulting binary image.
 |
Figure 3.14:
Simulation of nested elbows: (i) Conventional mask;
(ii) Phase-shift mask. Top: Layout; Bottom: Binary mask
after applying threshold.
 |
Next: 3.5 Global Perspective
Up: 3.4 Layout and Lithography
Previous: 3.4.2 Taking Lithographic Effects
Rui Martins
1999-02-24