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Here we present some results of the application of the methods described
previously. We start with a medium size layout and a conventional imaging
system: Figure 3.13-(i) depicts the aerial image of mask
METAL2 of the layout in Figure 3.2. The simulated
imaging system uses a lens with a numerical aperture NA of 0.55, a wavelength
of 365nm (I-line) and the focus error is .
The resulting
binary mask is shown in Figure 3.13-(ii). The simulation
time for this relatively large example is only five minutes onn
a DEC-600 workstation.
In the second example phase-shift masks are
used. Figure 3.14 shows
simulation results of one layout with nested
elbows and minimum feature size of 0.4m. We compare conventional
binary masks (left) with alternating phase-shifting masks (right). The
simulation parameters are: Numerical aperture of
,
a
wavelength of also 365nm (I-line), and a focus error
of .
Figure 3.14-bottom demonstrates the
superior performance of phase-shifting masks.
Figure 3.13:
Lithography simulation of the layout in
Figure 3.2 (layer METAL2): (i) -
Aerial image; (ii) - Resulting binary image.
|
Figure 3.14:
Simulation of nested elbows: (i) Conventional mask;
(ii) Phase-shift mask. Top: Layout; Bottom: Binary mask
after applying threshold.
|
Next: 3.5 Global Perspective
Up: 3.4 Layout and Lithography
Previous: 3.4.2 Taking Lithographic Effects
Rui Martins
1999-02-24