Next: 2.3 Layout
Up: 2. The Processing Chain
Previous: 2.1 Overview
As mentioned above the integration between design of integrated circuits and
their simulation is already very efficient. The circuit design is almost
exclusively performed at workstations by using a sophisticated set of software
tools to model the behaviour of the schematic to be implemented as
integrated circuit on silicon wafers. To enable a high degree of modeling
accuracy an extensive set of characterization of the available devices on
silicon has to be done in advance. This task is called process and device
characterization (PDC). It will be shown in Chapter 4
how TCAD may support this task especially for the development of new process
technologies.
PDC is generating the model parameters for the SPICE models used by
circuit designers. The consistency and accuracy of these SPICE models is
absolutely mandatory for enabling designs with the envisaged electrical
specifications.
The generation of the SPICE models is carried out after the semiconductor process
freeze during development of new process flows or occasionally, if some major
semiconductor process change occurred. To reflect shifts or drifts in the
semiconductor device performance as well as the statistical variations of the
process technology a feedback loop is established between electrical test and
the SPICE models. This feedback is implemented by using the pass/fail limits
of the electrical test to supply worst/case conditions to the
designer. There are numerous new approaches for simulating statistical fabrication
fluctuations within the ECAD environment labeled under the term DFM (design for
manufacturability) [24],[25], however, the details
are outside of the scope of this work. By using SPICE models, EDA (Electronic
Design Automation) design tools from companies like
Mentor [26], Cadence [27], or
Agilent [28] are able to simulate the behaviour of the schematic
entered by hand or imported with net lists. A typical design flow is shown in
Figure 2.3.
Figure 2.3:
Design flow of a mixed-signal design, comprising of an analog
and a digital part
|
Next: 2.3 Layout
Up: 2. The Processing Chain
Previous: 2.1 Overview
R. Minixhofer: Integrating Technology Simulation
into the Semiconductor Manufacturing Environment