Next: 4. Simulation Application
Up: 3.7 Generation and Recombination
Previous: 3.7.4 Band-to-Band Tunneling
Subsections
3.7.5 Impact Ionization
The impact ionization (II) models support both the drift-diffusion (DD) and the
hydrodynamic (HD) transport models, therefore, electric field dependent DD II models
and carrier temperature dependent HD II models are used in MINIMOS-NT.
3.7.5.1 Drift-Diffusion Impact Ionization
In DD simulation the model from [33] is used to calculate the II
generation rates for electrons and holes, respectively. The overall generation
rate is the sum of these two generation rates and can be expressed as a negative
recombination rate.
|
(3.152) |
The ionization coefficients
and
are expressed by Chynoweth's law
|
|
|
(3.153) |
|
|
|
(3.154) |
The default values are summarized in Table 3.38.
Table 3.38:
Parameter values for DD impact ionization model
Material |
[m] |
[V/m] |
|
[m] |
[V/m] |
|
Reference |
Si |
7.03e7 |
1.231e8 |
1.0 |
1.528e8 |
2.036e8 |
1.0 |
|
Ge |
1.55e9 |
1.560e8 |
1.0 |
1e9 |
1.28e8 |
1.0 |
[33] |
GaAs |
3.5e7 |
6.85e7 |
2.0 |
3.5e7 |
6.85e7 |
2.0 |
[190] |
GaP |
4.0e7 |
1.18e8 |
2.0 |
4.0e7 |
1.18e8 |
2.0 |
[190] |
|
To account for surface effects, the surface ionization rates
and
can deviate from the
bulk rates. The electron surface ionization rate is calculated in a similar
way (analog for holes)
|
(3.155) |
is given by (3.120) and depending on the
surface distance describes a smooth transition between the surface and bulk
generation rates. The parameter
denotes a critical
length. The final surface dependent ionization rate
reads
|
(3.156) |
The effect is considered only for Si and the following values are used:
Table 3.39:
Parameter values for surface DD impact ionization model
Material |
[m] |
[V/m] |
[m] |
[V/m] |
[nm] |
Si |
1.03e7 |
1.50e8 |
4.0e8 |
3.0e8 |
10 |
|
In a HD simulation, the carrier temperatures are used as parameters
in the hydrodynamic impact ionization model. The implemented equation for the
electron generation rate depending on the concentration and the bandgap
energy
[191,192] reads (analog for holes)
|
(3.157) |
|
(3.158) |
The prefactor depends on the carrier and lattice temperatures and the local
bandgap
|
(3.159) |
The variables and correspond to 300 K and
,
respectively.
Table 3.40:
Parameter values for HD impact ionization model
Material |
[s] |
|
|
|
Si |
9.531e-9 |
3.823 |
0.346333 |
0.0922 |
|
The overall generation rate is the sum of the electron and hole generation
rates, and is equal to a negative recombination rate
|
(3.160) |
Another simple, but very practical model is available for modeling the impact
ionization rate in all semiconductors. It reads for electrons
|
(3.161) |
and, respectively, for holes
|
(3.162) |
The default values recommended for the simple HD II model are summarized in the
following table:
Table 3.41:
Parameter values for HD impact ionization model
Material |
[s] |
|
Si&Ge |
1e13 |
0.92 |
III-Vs |
1e13 |
1.0 |
|
This model has been already successfully applied in simulation of GaAs-based
and InP-based HEMTs [193,194]. However, it has not been
applied in simulation of III-V HBTs yet.
Next: 4. Simulation Application
Up: 3.7 Generation and Recombination
Previous: 3.7.4 Band-to-Band Tunneling
Vassil Palankovski
2001-02-28