CIM takes care of the smooth, automated operation of the fabrication unit and all equipment. Raw wafers are processed by applying treatments - thermal treatment, ion implantation, gas atmospheres, etc. - to induce physical and chemical processes to alter the material surface structure and the distribution of dopants in the material bulk. Up to several hundred treatments are applied sequentially to each wafer before an integrated circuit is completed. Most fabrication equipment is controlled by workstations that manage recipes, monitor equipment state and operation, and detect malfunctions. The location of each wafer lot in the fab at any given moment is tracked automatically together with the processing history and the remaining process flow.