The design and fabrication of an integrated circuit is a complicated endeavor [Bon91]. Modern Very Large Scale Integration (VLSI) technology uses fabrication processes that consist of several hundred process steps being applied one after the other to the raw semiconductor wafer to manufacture an integrated circuit [WE93]. The development of new device generations continuously pushes the limits of knowledge of the physics involved, at the same time making equipment and fabrication installations more expensive and increasing the costs of experiments.
To cope with these challenges, semiconductor technology makes extensive use of computer-aided design (CAD) methodologies to reduce technology development costs and to improve product quality. Figure 1.1 gives an overview of the realms of Electronic CAD (ECAD), Technology CAD (TCAD), and Computer-Integrated Manufacturing (CIM) in VLSI manufacturing.
Figure 1.1:
CIM, ECAD, and TCAD in VLSI manufacturing.
Feedback loops are not shown.