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E. STRASSER, K. WIMMER, AND S. SELBERHERR.
A New Method for Simulation of Etching and Deposition Processes.
In Proceedings: 1993 International Workshop on VLSI Process and
Device Modeling,
Nara, Mai 1993, pp. 54-55.
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E. STRASSER AND S. SELBERHERR.
A General Simulation Method for Etching and Deposition Processes.
In Proceedings: Simulation of Semiconductor Devices and Processes,
Wien, Sept. 1993, pp. 357-360.
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E. STRASSER AND S. SELBERHERR.
Analysis of the Fabrication Process of Multilayer Vertical
Stacked Capacitors.
In Proceedings: European Solid State Device Research Conference,
Grenoble, Sept. 1993, pp. 587-590.
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E. STRASSER, G. SCHROM, K. WIMMER, AND S. SELBERHERR.
Accurate Simulation of Pattern Transfer Processes Using Minkowski
Operations.
IEICE Transactions on Electronics, Vol. E77-C, No. 2,
Feb. 1994, pp. 92-97.
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E. STRASSER AND S. SELBERHERR.
Three-Dimensional Simulation of Step Coverage for Contact Hole
Metallization.
In Proceedings: European Solid State Device Research Conference,
Edinburgh, Sept. 1994, pp. 339-342.
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E. STRASSER AND S. SELBERHERR.
A New Method for Topography Simulation.
Submitted to: IEEE Transactions on Computer-Aided Design of Integrated
Circuits and Systems.
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E. STRASSER AND S. SELBERHERR. Three-Dimensional Models and
Algorithms for Wafer Topography Evaluation (invited). To appear in
proceedings: Microelectronics-94 Conference, Moskau,
Dec. 1994.
Martin Stiftinger
Thu Nov 24 17:41:25 MET 1994