It was mentioned in Chapter 2 that due to the anisotropic nature of the SiC
crystal structure, anisotropic electronic properties should be expected. This means that
electrical characteristics will be different depending on the orientation of the device with
respect to the crystal. The most commonly used orientation has the wafer surface
perpendicular to the c-axis (Fig. 3.1), which means that the current transport
is better in the lateral device compared with a vertical device. However, most electrical
devices depend on the vertical current transport, since it is easier to manufacture a
blocking layer parallel to the surface.
In the numerical simulation of semiconductor devices
Figure 3.1:
Wafer with surface perpendicular to the c-axis: current transport parallel and vertical to the c-axis.
it is generally assumed that the semiconductor material is isotropic, which is the case for
cubic materials such as Si and GaAs. For SiC and for various nitrides, which generally
crystallize in structures of symmetry lower than cubic (except for 3C-SiC), a rigorous model
implementation in device simulation programs must account for the anisotropic properties.
Consider the following relation between the current density
and the
electric field
(3.1)
where the conductivity
for hexagonal polytypes of SiC can be described
with a second rank tensor of the diagonal form [103]
(3.2)
From (3.1) and (3.2) we see that the x and y components, say of the
current density vectors, are governed by the tensor components represented by ,
whereas the z component of the current density is governed by the tensor components
represented by . From now on we use the conductivity tensor as
=
and =
representative to mean any of the second
tensors in all the electrical transport equations formulated in this chapter.
Subsections