The main parameter, besides the thickness of the dielectric, influencing
tunneling current is the height of the energy barrier. The influence of this
parameter is depicted in Fig. 5.6. Different dielectric
materials strongly differ in their work function difference to silicon. It
must be distinguished between the barrier height for electrons and for
holes. The most frequently used dielectric material SiO has an electron
barrier height of about 3.2eV and a hole barrier height of approximately
4.6eV. The measurement of these material parameters is difficult and values
in the available literature vary widely (see Section 5.1.5).
Figure 5.6:
Effect of the electron and hole barrier
height on electron tunneling current (left) and hole tunneling current (right)
in an nMOS (top) and a pMOS (bottom) with 2 nm dielectric thickness,
1e20 cm-3 polysilicon and 5e18 cm-3 substrate doping.