Combining process and device simulation to compute the fabrication and operation of semiconductor devices allows to study the influence of process parameters on the device characteristics. In a typical industrial environment, circuit designers ask for a certain device behavior that has to be met - within a certain range - by the devices leaving the fabrication unit in order for the integrated circuits to work properly and meet their respective specifications. By adjusting the process flow sequence and process parameters, process design aims at ensuring that a large fraction of all devices fabricated fall into the acceptable range. Due to the extremely high costs of real-silicon experiments and the notorious lack of time and man-power in a highly competitive industry, the necessary parameter adjustments are frequently done in the virtual world of simulation, with only a very small number of actual experimental wafer runs granted to the process designers.