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3.1.3 Filling
Filling is an auxiliary function and can be interpreted as deposition step
which neglects the effects of the underlying geometry. Working in a way like
pouring a liquid over the structure, it is a predominantly geometric
function and has no correspondence in real life wafer processing. Even
though, it is very useful for geometry editing, as can be seen in our example
where the structure is now filled with a second material, as evident in
Fig. 3.4.
Figure 3.4:
Filling operation.
![\begin{figure}\begin{center}
\psfrag{1.2 \247m}[][cb][1.7]{{1.2 \mbox{$\mu\math...
...49\textwidth}{!}{\includegraphics{eps-geo/filled.eps}}}
\end{center}\end{figure}](img130.gif) |
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Up: 3.1 Solid Modeling
Next: 3.1.4 Chemical Mechanical Planarization
W. Pyka: Feature Scale Modeling for Etching and
Deposition Processes in Semiconductor Manufacturing