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Dissertation Markus Gritsch
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1. Introduction and Overview
List of Figures
2.1.
Shape of a shifted M
AXWELL
distribution function
and its symmetric
and anti-symmetric
parts. The displacement is assumed to be large.
2.2.
Shape of a shifted M
AXWELL
distribution function
and its symmetric
and anti-symmetric
parts. The displacement is assumed to be small.
2.3.
Symmetrical
and anti-symmetric
parts of a shifted M
AXWELL
distribution function in comparison with the result of the diffusion approximation.
2.4.
Comparison of the different closure relations with the sixth moment from a Monte Carlo simulation.
2.5.
Symbolic band diagram showing the four partial processes involved in indirect generation/recombination.
3.1.
Schematic representation of an orthogonal mesh discretizing the active region of a MOSFET.
3.2.
Three adjacent grid points together with some notational abbreviations used in the derivation.
3.3.
A set of 13 grid points together with their associated V
ORONOI
regions which are bounded by the dashed lines.
3.4.
Control volume of grid point
used for the box integration method.
3.5.
Functional shape of the growth function
displayed in a normalized interval with
as parameter.
4.1.
Sketch of the simulated SOI MOSFET including symbolic compact devices. Important effects are S
HOCKLEY-
R
EAD-
H
ALL
generation/recombination (SRH) and impact-ionization (II).
4.2.
Output characteristics of the SOI (Device 1) obtained by drift-diffusion simulations with and without impact-ionization.
4.3.
Distributed potential of the SOI (Device 1) obtained by drift-diffusion simulations with impact-ionization turned on. The cutline through the device is located at a depth of
.
4.4.
Distributed potential of the SOI (Device 1) obtained by drift-diffusion simulations with impact-ionization turned off. The cutline through the device is located at a depth of
.
4.5.
Output characteristics of the SOI (Device 1) obtained by energy transport simulations using the device simulators M
INIMOS-
NT and DESSIS. The influence of impact-ionization is also shown.
4.6.
Output characteristics of the SOI with a body contact (Device 2) obtained by energy transport simulations.
4.7.
Bulk currents of the SOI with body contact (Device 2) obtained by energy transport simulations.
4.8.
Comparison of the drain currents of the SOI (Device 1) and the device with body contact (Device 2) obtained by drift-diffusion simulations.
4.9.
Distributed potential of the SOI (Device 1) obtained by energy transport simulations at a depth of
. The body potential drops below the equilibrium value of
.
4.10.
Threshold voltage as a function of the body bias of the SOI with a body contact (Device 2) obtained by drift-diffusion simulations. The threshold voltage was defined as the gate-source voltage at which the drain current equals
.
4.11.
Electron concentration in the SOI (Device 1) obtained by a drift-diffusion simulation.
4.12.
Electron concentration in the SOI (Device 1) obtained by an energy transport simulation.
4.13.
SRH net-generation in the SOI (Device 1) obtained by a drift-diffusion simulation. Generation occurs only in the drain-body junction.
4.14.
SRH net-generation in the SOI (Device 1) obtained by an energy transport simulation. Generation occurs in both junctions.
4.15.
SRH net-recombination in the SOI (Device 1) obtained by a drift-diffusion simulation. Recombination occurs only in the source-body junction.
4.16.
SRH net-recombination in the SOI (Device 1) obtained by an energy transport simulation. Recombination occurs in the whole p-body.
4.17.
Body potential of the SOI (Device 1) obtained by a transient energy transport simulation.
4.18.
Drain currents of the SOI (Device 1) obtained by a transient energy transport simulation showing different sweep times.
4.19.
Body potentials of the SOI (Device 1) obtained by a transient energy transport simulation showing different sweep times.
4.20.
Drain currents of the SOI (Device 1) obtained by a energy transport simulations showing different body dopings
.
5.1.
Electron concentration in a MOSFET (Device 3) obtained by energy transport and Monte Carlo simulations.
5.2.
Electron concentration in a MOSFET (Device 3) obtained by drift-diffusion and Monte Carlo simulations.
5.3.
Comparison of the electron concentration in a MOSFET (Device 3) at a vertical cut located in the middle between source and drain obtained by drift-diffusion, energy transport, and Monte Carlo simulations.
5.4.
Components of the temperature tensor compared to the temperature
from the mean energy obtained by Monte Carlo simulations.
5.5.
Temperature from the mean electron energy along the channel of a MOS transistor. Six characteristic points are marked for later reference.
5.6.
Electron distribution function at six characteristics points along the channel of a MOS transistor. Note that the average energies for the points B and E are the same.
5.7.
The distribution function at six characteristic points approximated by a M
AXWELL
distribution. Except for the contact regions the distribution function is never anything like a M
AXWELL
ian.
5.8.
The shape of the distribution function in four characteristic regions. (Picture gratefully taken from [
69
] with kind permission from the author.)
5.9.
Distribution function in bulk for different electric field values.
6.1.
Approximation of the anisotropic temperature by the analytical models.
6.2.
Components of the temperature tensor obtained by Monte Carlo simulations compared to the analytical model of
.
6.3.
Kurtosis
as a function of the temperature
for bulk silicon with the doping concentration as a parameter together with the analytical expression for
.
6.4.
Monte Carlo simulation of an
-
-
structure showing the normalized moment of fourth order
compared to the analytical
.
6.5.
Monte Carlo simulation of an
-
-
structure showing the hysteresis of the normalized moment of fourth order
compared to the analytical
.
6.6.
Comparison of the non-M
AXWELL
ian parameter obtained by Monte Carlo simulations and the empirical model
.
6.7.
Shape of the functions used to model
and
.
and
have been chosen to be
.
6.8.
Monte Carlo simulation of a
and a
MOSFET (Device 3 with different gate-lengths) showing the
-component of the temperature tensor at the surface compared to the temperature
from the mean energy. The analytical model for
uses
.
6.9.
Monte Carlo simulation of a
and a
MOSFET (Device 3 with different gate-lengths) showing the normalized moment of fourth order
at the surface compared to the analytical model for
with
.
6.10.
Output characteristics of the SOI (Device 1) obtained by anisotropic energy transport simulations without closure modification (
).
6.11.
Output characteristics of the SOI (Device 1) assuming an anisotropic temperature (
) and a modified closure relation at
.
6.12.
Electron concentration in a MOSFET (Device 3) obtained by simulations using the modified energy transport model compared to Monte Carlo data.
6.13.
Comparison of the electron concentration in a MOSFET (Device 3) at a vertical cut located in the middle between source and drain obtained by simulations using drift-diffusion (DD), standard energy transport (ET), Monte Carlo (MC), and the modified energy transport (MET) model.
6.14.
Output characteristics of the "Well-Tempered" SOI (Device 4) at
.
6.15.
Electron concentration in the "Well-Tempered" SOI (Device 4) obtained by a standard energy transport and a modified energy transport simulation.
6.16.
Vertical potential distribution in the "Well-Tempered" SOI (Device 4) obtained by drift-diffusion, energy transport, and modified energy transport simulations.
6.17.
Output characteristics of an SOI similar to Device 1 but with coarser grid in vertical direction.
 
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Constants
Up:
Dissertation Markus Gritsch
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1. Introduction and Overview
M. Gritsch: Numerical Modeling of Silicon-on-Insulator MOSFETs
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