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Contents
List of Tables
List of Figures
1. Introduction
1.1 Radio Frequency
1.2 Devices for RF Applications
1.2.1 Devices Based on the III-V Material System
1.2.2 Devices Based on Silicon
1.3 Numerical Simulators
1.3.1 The Commercial Simulators
1.3.2 The Device and Circuit Simulator Minimos-NT
2. Device Simulation
2.1 The Analytical Problem
2.1.1 The Drift-Diffusion Transport Model
2.1.2 Types of Partial Differential Equations
2.1.3 Systematic Derivation of the Macroscopic Transport Models
2.1.4 The Six Moments Transport Model
2.1.5 The Energy-Transport Model
2.1.6 The Drift-Diffusion Transport Model
2.2 The Discretized Problem
2.2.1 Interface Conditions
2.2.2 Boundary Conditions
2.3 Steady-State and Transient Analysis
2.3.1 Solving the Nonlinear System
2.3.2 Transient Simulation
2.4 Small-Signal Simulation
2.4.1 Equivalent Circuits
2.4.2 Sinusoidal Steady-State Analysis
2.5 Derivation of the Complex-Valued Small-Signal System
2.5.1 Boundary Conditions and the Complete System
2.5.2 Extension for Higher-Order Transport Models
2.6 Concluding Remarks
2.6.1 Harmonic Balance
2.6.2 Complex-Valued Equation Systems
3. Small-Signal AC Analysis
3.1 Introduction
3.1.1 Admittance, Impedance, Hybrid Matrices and Parameters
3.1.2 Scattering Parameters
3.1.3 Extraction of the Cut-Off and Maximum Oscillation Frequency
3.2 Overview of the Minimos-NT Small-Signal Capabilities
3.3 Standard Single-Mode AC Analysis
3.3.1 Introduction
3.3.2 Simulation Example
3.3.3 Extraction of the Cut-Off Frequency
3.4 Extended Single-Mode AC Analysis
3.4.1 Capacitance Matrix
3.4.2 Simulation Example
3.5 Transformation to Extrinsic Parameters
3.6 Small-Signal Capabilities for Mixed-Mode Device/Circuit Simulations
3.6.1 Mixed-Mode Simulation
3.6.2 The Nodal Approach and Modified Nodal Approach
3.6.3 Two-Level Newton and Full Newton Methods
3.6.4 Iteration Schemes
3.6.5 The Mixed-Mode AC Capabilities
3.7 Concluding Remarks
4. The Assembly Module
4.1 Key Demands on the Assembly Module
4.2 Approaches to Meet these Demands
4.2.1 Third Party Modules and Packages
4.2.2 A New Generally Applicable Assembly Module
4.3 Refined Key Demands on the Assembly Module
4.4 Condition of the Linear System
4.5 The Parameter Administration
4.6 Assembling the Complete Linear Equation System
4.7 Compiling the Complete Linear Equation System
4.7.1 Row Transformation
4.7.2 Variable Transformation
4.8 The Pre-Elimination
4.9 Sorting the Inner Linear Equation System
4.10 Scaling the Inner Linear Equation System
4.11 Solving and Back-Substitution
4.12 Newton Adjustment
4.12.1 The Administration Scheme
4.12.2 Newton Adjustment Levels
4.12.3 Improved Sorting Feature
4.13 The Transferred-Transformation Problem
4.13.1 Mathematics
4.13.2 The Basic Correction Algorithm
4.13.3 The Advanced Algorithm
4.14 Concluding Remarks
5. The Solver Module
5.1 Third Party Modules and Libraries
5.1.1 Commercial Libraries
5.1.2 Libraries of Hardware Vendors
5.1.3 Recent Developments
5.1.4 Solver Frameworks
5.1.5 Special-Purpose Libraries
5.1.6 Discussion
5.2 Overview of the Solver Module
5.2.1 Solver Selection
5.2.2 In-House Direct Solvers
5.2.3 In-House Iterative Solvers
5.2.4 The Generalized Minimal Residual Method
5.2.5 Preconditioner
5.3 External Solvers
5.3.1 Parallelization Issues
5.3.2 Pardiso
5.3.3 Algebraic Multigrid Methods for Systems
5.4 Solver Hierarchy
5.5 Practical Evaluation of the Solvers
5.5.1 Test Examples and Processing
5.5.2 General Quantitative Comparisons
5.5.3 Simulation Results of the GMRES(m) Evaluation
5.5.4 Simulation Results of the Performance Evaluation
5.5.5 Evaluation of Solvers for Higher-Order Transport Models
5.6 Concluding Remarks
6. Examples
6.1 Simulation of an InGaP/GaAs Heterojunction Bipolar Transistor
6.2 Simulation of a SiGe Heterojunction Bipolar Transistor
6.3 Simulation of a 4H-SiC MESFET
6.4 Oscillator
6.4.1 Amplifier
6.4.2 Amplifier with Resonant Circuit
6.4.3 Colpitts Oscillator Circuit
6.5 Simulations with Higher-Order Transport Models
6.5.1 Simulation Results
6.5.2 Conclusions
7. Summary and Outlook
A. Input-Deck Interface to the New Simulator Features
A.1 Activation of the Transient and Small-Signal Mode
A.2 Activation of the Admittance Matrix Calculation Feature
A.3 Simulation Setup of the Diode Example
A.4 Inquiring Capacitances
A.5 Configuration of the Two-Port Features
A.6 Output Functions
A.7 Setup for the Cut-Off Frequency Extraction
A.8 Setup of the Resonant Circuit and the Band Rejection Filter
A.9 Inquiring Complex-Valued Node Voltages and Terminal Quantities
A.10 Setup for the Extended Mixed-Mode AC Simulation
A.11 Inquiring Circuit Quantities
A.12 Selection of External Solvers
A.13 Netlist Definition of the Oscillator Example
B. The Stepping Module of Minimos-NT
B.1 The Basic Stepping Functions
B.2 The Special-Purpose Stepping Functions
B.3 Conditional Stepping
B.4 Stepping Control
B.5 Additional Stepping Control Keywords
C. Miscellaneous Projects
C.1 The Minimos-NT Post-Processing System
C.2 The Minimos-NT Interactive Mode
C.3 SEILIB - The Simulation Environment Interaction Library
C.3.1 Motivation
C.3.2 Getting Started
C.3.3 Basic Nomenclature and Definitions
C.3.4 The Argument System
C.3.5 Process Management System
C.3.6 The Host Management System
C.3.7 Class Diagram
C.3.8 Example Application: The Minimos-NT Test
C.3.9 The Optimization System
C.4 The Minimos-NT Test
C.4.1 Numerics
C.4.2 Nomenclature and Definitions
C.4.3 Test Levels
C.4.4 File Structure
C.4.5 Model Identification System
C.4.6 The References
D. Calculation of Additional Extrinsic Parameters
E. Matrix Storage Formats
E.1 Modified Compressed Sparse Row Matrices
E.2 Compressed Sparse Row - Variant 1
E.3 Compressed Sparse Row - Variant 2
E.4 Matrix Storage Format Conversion
Bibliography
Own Publications
Next:
List of Tables
Up:
Dissertation Stephan Wagner
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S. Wagner: Small-Signal Device and Circuit Simulation
