The impact of various high-temperature processing steps on the charge state of the SiC/SiO2 interface was investigated using 4H-SiC n-MOSCAPs and CV measurements. By comparing the measured CV curves to an ideal, simulated CV curve, it was shown that during the processing of SiC/SiO2 based semiconductor structures a significant accumulation of positive charges occurs at the semiconductor-insulator interface. The build-up of positive charges starts after the deposition of the polycrystalline gate contact and continues in all additional processing steps, in which the sample is exposed to a high thermal budget with temperatures above 500 °C. The positive charge accumulation leads to a significant shift of the flatband voltage . The observed flatband voltage shift ranges from after the deposition of the poly-Si gate contact at , to approximately after the formation of the metal contact at a temperature of approximately .
The origin of these charges is still unknown. However, two possible candidates have been discussed:
• First, positive impurities (ions) with low diffusion coefficients at room temperature, which are randomly distributed throughout the SiO2. After subjecting the sample to a high temperature, these ions might be able to diffuse with a preferred direction along the oxide field, which points in the direction of the SiC/SiO2 interface.
• Second, high amounts of hydrogen are incorporated during the deposition of the polycrystalline gate contact, which can be trapped in various configurations in the amorphous SiO2. Assuming the diffusivity of hydrogen in the the amorphous SiO2 is not rate limiting [70], an energy barrier of approximately was extracted from the experimental data, which is in good agreement with proposed hydrogen-related trapping mechanisms like the hydrogen release model [48, 58, 132, 133].
To summarize, a significant amount of positive charge accumulates at the SiC/SiO2 interface during high- processing steps. The atomic origin of the charge build-up is still unknown but likely linked to hydrogen, which is incorporated during the poly-Si deposition. However, to enable a better understanding, further studies on the observed behavior are mandatory. Here, especially a combination with measurement techniques like secondary ion mass spectrometry (SIMS), which enable the analysis of the exact composition of the specimen, should be advantageous.
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